Siemens has announced the release of its Innovator3D IC solution suite, which aims to enhance the design and analysis of complex, heterogeneously integrated 3D integrated circuits (ICs). This suite offers a streamlined approach for planning and integration, along with implementation of substrates and interposers, interface protocol compliance analysis, and management of design data. It features an AI-enhanced user experience that supports extensive multithreading and multicore capabilities.
The Innovator3D IC solution suite includes several components: the Innovator3D IC Integrator for constructing digital twins using a unified data model; the Innovator3D IC Layout solution for implementing package interposers and substrates; the Innovator3D IC Protocol Analyzer for analyzing chiplet-to-chiplet and die-to-die interface compliance; and the Innovator3D IC Data Management solution for managing designs in progress.
To address challenges posed by thinner dies and higher processing temperatures in 2.5D/3D IC architectures, Siemens introduced Calibre 3DStress. This tool provides accurate transistor-level analysis, verification, and debugging of thermo-mechanical stresses within 3D IC packaging. By allowing designers to assess chip-package interactions early in development, Calibre 3DStress helps prevent future failures while optimizing design performance and durability.
Building on Calibre 3DThermal’s launch in 2024, Calibre 3DStress extends Siemens’ Multiphysics solutions by reducing thermo-mechanical impacts. Unlike other stress analysis tools at the package level, it detects transistor-level stress to ensure that neither packaging processes nor product functionalities compromise circuit performance.
Customer feedback highlights positive experiences with Siemens’ technologies. Bryan Black, CEO of Chipletz stated: “In 2023, we adopted Siemens’ technology to meet the complex design and integration challenges of our advanced platform solutions. The Innovator3D IC solution suite plays a critical role in enabling the high-performance solutions we deliver to AI and HPC datacenters.” Similarly, Sandro Dalle Feste from STMicroelectronics commented on their use of Calibre 3DStress: “Siemens EDA’s Calibre 3DStress tool can synthesize the complexity of components…and create accurate IP-level stress analysis…The result is improved reliability and quality together with a reduced time to market.”
For more information about Siemens’ solutions for 2.5D/3DIC architectures, interested parties are encouraged to visit their website.
Siemens Digital Industries Software continues to support organizations in digital transformation through software, hardware, and services from its Xcelerator business platform. Their comprehensive digital twin technology aids companies in optimizing design processes across various industries.
