ASML highlights integrated lithography solutions at SEMICON India 2025

Christophe Fouquet President and Chief Executive Officer ASML Holding N.V.
Christophe Fouquet President and Chief Executive Officer - ASML Holding N.V.
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ASML participated in SEMICON India 2025 for the first time, highlighting its intention to support India’s semiconductor industry. The company presented its holistic lithography portfolio, which includes integrated lithography systems, computational software, metrology, and inspection solutions.

India’s semiconductor sector is expected to grow significantly in the coming years. Market projections estimate that it will surpass USD 55 billion by 2026 and reach USD 100 billion by 2030. This growth is being driven by increased demand from sectors such as smartphones, automotive applications, and 5G IoT technology, as well as government initiatives aimed at boosting domestic chip manufacturing.

ASML’s approach combines three main product areas: advanced lithography systems that use light to create detailed patterns on silicon wafers; computational lithography software that enables automated adjustments during production; and metrology and inspection tools that measure dimensions and detect defects to maintain process stability.

By integrating these technologies, ASML aims to help Indian chip manufacturers increase production efficiency and output quality. This approach can assist new fabrication facilities in India with capacity expansion while providing access to scalable technologies suited for future innovation.

Christophe Fouquet, President and CEO of ASML, addressed attendees at SEMICON India 2025: “India has been showing progress in developing its ambitions in the semiconductor industry with investments, a strong talent pool and clear support from the government. We welcome India’s vision as it will strengthen the global industry. ASML is participating in SEMICON India for the first time. We look forward to learning more about India’s semiconductor industry, establishing new relationships and preparing opportunities.”



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